Sony Xperia 1 VIII leak hints at thicker body for a bigger camera upgrade
A new set of leaked Sony Xperia 1 VIII renders is offering the clearest look yet at what is said to be the phone’s final design. The images, shared by MyMobiles, are described as being based on CAD files similar to those used across Sony’s supply chain.
The front appears to stick with Sony’s familiar tall, narrow look, including a selfie camera housed in the top bezel next to the earpiece. That would mark a shift away from earlier leaked renders that hinted Sony might move to a punch-hole cutout.
Dimensions point to subtle changes
According to the leak, Xperia 1 VIII is expected to measure 161.9 x 74.4 x 8.58 mm. That would make it close to its predecessor, but slightly wider and thicker overall.
The more noticeable change may be at the rear, where the redesigned camera housing is said to push thickness to about 11.37 mm at its thickest point. If accurate, that would be over 2 mm thicker than the Xperia 1 VII, suggesting Sony is prioritizing camera hardware over a slimmer profile.
Why Sony may be going thicker?
Previous rumors have suggested Sony is redesigning the camera module to accommodate larger image sensors than those used in the Xperia 1 VII. The telephoto camera is rumored to get a larger sensor, with estimates ranging from 1/3 inch up to 1/2 inch.
The new renders also point to a similar overall screen approach, with expectations that Sony will keep a 6.5-inch OLED display and comparable bezel width. If that holds, the main external changes may be concentrated around the camera island and body thickness.
Timing expectations remain similar to last year, with rumors pointing to a May announcement and wider availability in June. Sony has not confirmed the Xperia 1 VIII or its specifications.
